Omercon (R) Chemical Tin as an alternative to HAL
March 2009: Beta LAYOUT is now offering Chemical Tin as a finish.The tinning is similar to HAL, which is a partial covering and has nothing to do with the old method of Lead / Tin reflow.
- Due to the smooth surface finish, assembly of fine pitch is considerably easier.
- The circuit board is not put under the same temperature stress as with the HAL process, and as such does not suffer from warping or bending.
- The Chemical Tin surface allows for multiple soldering, and also shows great results with press-fit technology
- The soldering parameters are on par with those of a HAL surface finish.