Omercon (R) Chemical Tin as an alternative to HAL

March 2009: Beta LAYOUT is now offering Chemical Tin as a finish.

The tinning is similar to HAL, which is a partial covering and has nothing to do with the old method of Lead / Tin reflow.
  • Due to the smooth surface finish, assembly of fine pitch is considerably easier.

  • The circuit board is not put under the same temperature stress as with the HAL process, and as such does not suffer from warping or bending.

  • The Chemical Tin surface allows for multiple soldering, and also shows great results with press-fit technology

  • The soldering parameters are on par with those of a HAL surface finish.

For more information please visit our specifications page.