Flexible PCBs in the Flex-POOL:
The minimum area, from which the base price is calculated is 1 dm². In the Flex-Pool a maximum of 20 dm² area is possible.
You can calculate the cost for your Flex PCB prototypes using our Online price calculator.
For larger quantities and special technologies, which are not produced by us in the Flex-POOL, please use our custom quote, or contact us directly via telephone or e-mail.
Only polyimide foils are used as the base material. These provide different benefits compared to other foils, differing substantially from rigid PCB materials. If needed, please download our data sheet.
||≥ 0.70 N/mm2
||≤ 3.7 (1.1 GHz)
|Resistance in the solder bath
||550,4 °F (288°C) (> 10 s)
||± 0.20 %
In the Flex-POOL a cover based Kapton®- /Acrylic is used, which, for example, ensures higher dielectric strength.
|Number of layers
||1 - 2
||One-sided or double-sided
||Electroless Nickel Immersion Gold
||1.97 mil (50 μm)
||0.71 mil (18 µm)
||7.87 mil (0.2 mm)
|Maximum size of the PCB
||Length: 15.75 inch (400 mm) / Width: 9.84 inch (250 mm)
|Minimum size of the PCB
||Length: 0.39 inch (10 mm) / Width: 0.39 inch (10 mm)
|Flex cover foil
||Relief cut: 7.87 mil (200 μm)
|Minimum conductor width / conductor distance
||4.92 mil (125 μm)
||Via diameter: 7.87 mil (200 μm)
|Minimum distance Via-Via
||17.72 mil (450 μm)
|Minimal cutting radius
||3.94 mil (100 μm)
|Minimum distance copper contour
||7.87 mil (200 μm)
||+/- 3.94 mil (100 μm)
If needed, download our data sheet here.
Before the component placement and the soldering process the flexible PCBs must be dried. Thereafter they have to be processed within 8 hours.
Please refer to the data sheet "Drying (tempering) PCBs".
Please note: If your enhancing material does not touch the edges of the PCB (for example, a connector) please request a quote from us.
- Bending radius is Approx. 6 x flex material thickness for one-sided flex layers and Approx. 12 x flex material thickness for double-sided flex layers
- Select the largest possible track widths and clearances in the flex area
- Bending area should have parallel, equal track widths having the same insulation resistance, which run perpendicular to the bending line
- Continuously tapered transitions from wide to narrow circuit paths are ideal
- Transitions from wide to narrow circuit paths at a 90° angle should be as large a radii that can be realized.
- The tracks on double-sided flexible components should be symmetrically offset
- Provide large, cut-out Cu surfaces in the layout if possible
- Select soldering surfaces to be as large as possible - select soldering pad diameters at least twice as large as the hole diameters
- Design track connections to the soldering pads to be droplet-shaped and rounded.
- Make cover film openings which are not photo-structured to be around 1 mm larger in circumference
- Always provide smooth (round) milling transitions
- Provide additional copper tracks as tear protection on the target bending points for flexible jibs
- Partial mechanical reinforcements can be added in the mating or assembly areas (thickness: 11.81 mil (0.3 mm)).